Potting glue, room temperature curing potting glue, electronic potting glue,

Features of electronic potting adhesive:

normal temperature curing, two-component, with heat conduction function, curing has the functions of insulation, waterproof, corrosion resistance, and protection of electronic equipment. The electronic potting adhesive is elastic after curing, and can also be repaired.
Application industry:
Medical devices, automotive electronics, communication equipment, electrical engineering, instruments and meters, new energy
Product application:
Electronic components, solar energy, backlight, electrical module

order number	inspecting item（Lrems）	technical requirement （Technique Request）
1	Appearance (Extreior)	White, flowing liquid
2	Viscosity (before curing) (Viscosity mPa..S）	A：2000 B:50
3	Specific gravity (Specific gravity 23℃)	0．98
4	Available time (In commission time h 25℃)	1-2h
5	Overall Cure Time (Entirely sulfuration time min 25℃)	8-12h
6	Shaw Hardness (Hardness JIS A)	25A
7	Volume resistivity (Volume resistivity Ω cm)	≥1×10¹⁴
8	Breakdown voltage (Strength of breakdown voltage kv / mm)	18-25
9	Dielectric constant (Dielectric constant 1MHZ)	2．5-3．0
10	Dielectric loss angle tangent (Dielectric loss 1MHZ)	≤4×10^-3
11	Thermal conductivity (Thermal conductivity w / m.k	0.1-0.20

usage method

Use method of electronic potting adhesive:
Proportion: A: B=10:1 (weight ratio)
Operating time: 100G mixing capacity at 25 ℃, operating time: 40 minutes
Curing time: surface drying for 2-8 hours, complete curing for 24 hours
1. Before use, make sure to mix A/B evenly (agent A has been placed for a long time, and there is filler at the bottom),
2. The electronic scale in use shall be weighed according to the weight ratio of 10:1,
3. AB shall be mixed evenly (mixing shall be carried out clockwise and in the same direction),
4. After mixing and stirring evenly, the exhaust bubble can be filled into the product after a few minutes of rest, and the glue will gradually penetrate into the gap of the product. If necessary, it can be filled again. Complete curing within 24 hours.

matters needing attention

Precautions for electronic potting adhesive:
1. After mixing, AB will gradually solidify, gradually thicken and release a certain amount of heat.
2. The more the mixing, the faster the reaction, the shorter the operation time, and a large amount of heat will be released. Please pay attention to control the amount of glue at one time
3. It is recommended to wear protective gloves and wipe with alcohol or acetone if it is stuck to the hands.
4. Before mass production, pilot production in small batches should be carried out to master the use skills of products to avoid mistakes.
5. The product is stored in a cool and dry environment at 25 ℃, with a shelf life of 9 months. It can continue to be used after expiration and passing the test.
Scope of application:
Electronic or other products that need to be sealed, sealed, insulated and moisture-proof can be used