HN100 Non-silicone Thermal Pad 1.0W/m-k

Product Description:

Non-silicone Thermal Pad are made from a special resin-based non-silicon material. This material is free of siloxane volatilization and silicon oil precipitation, ensuring no circuit faults. It is also known as oil-free and pollution-free thermal conductive gaskets. These gaskets are suitable for silicon-sensitive applications, offer a lower hardness compared to traditional silicon materials, and provide greater deformation and enhanced thermal conductivity.

Application:

Exhibiting excellent tensile strength and wear resistance, it can be used in specialized fields such as hard drives, optical communication, high-end industrial control, medical electronics, automotive engine control devices, telecommunications hardware, and equipment.

Product Specifications:

Utilize the ASTMD5470 testing fixture. The recorded values encompass interface thermal resistance. These figures are merely for reference. The actual performance is intimately linked to the surface roughness, flatness, and pressure applied.

Note: The thickness tolerance stands at ± 10%, with hardness tolerance at ± 5°C. Color, thickness, and hardness can be tailored to customer specifications.

Product Features:

Non-silicone Thermal Pad are soft, silicon-free gap fillers characterized by high thermal conductivity, low thermal resistance, and high compressibility. Over extended periods of operation, these gaskets do not release small siloxane molecules, preventing them from accumulating and adversely affecting device performance. Silicon-free thermal conductive gaskets are designed to fit gaps between heat sources such as power-consuming electronic components, processors, and heat sinks/cases. Their excellent flexibility facilitates the removal of air at the interface, thereby reducing thermal resistance and enhancing heat transfer.

Advantages of Non-silicone Thermal Pad:

1、Customizable shapes and sizes to meet customer needs;

2、Self-adhesive; Simple operation, suitable for repetitive use;

3、Suitable for automatic mounting machines.

Typical Applications of Non-silicone Thermal Pad: Automotive applications, communication equipment, consumer electronics, industrial cameras, sensitive silicon devices, security systems, and military applications, medical devices, and high-precision instruments and equipment.

Product specifications:

Version product: 200 * 400 MM or according to customer requirements

Die cut products: according to customer requirements

Storage&Transportation ：

Store in a ventilated, cool, and dry place, do not come into contact with open flames. This product is non-toxic and is stored and transported as a non hazardous material。

Packaging:

Customized packaging according to customer needs

Shelf life:

24 months