Bakery Glue Solution

Glue analysis and solution
1、 Adhesive for bonding and sealing
Glue application position: outer frame plastic is bonded and sealed with plastic
Bonding and sealing of metal and plastic in baking furnace
Adhesive requirements: high temperature resistance, high bonding strength, waterproof, flame retardant, aging resistance
Recommended glue: HN-601C high-strength single component silicone sealant
Reason for recommendation: HN-601C is applicable to high-strength bonding between metals, plastics, glass, silica gel and other materials; Waterproof grade IP68, high and low temperature resistance (- 60-260), flame retardant coefficient 94-V0, aging resistance and other characteristics.

2、 Glue part: power module encapsulation
Glue requirements: waterproof, moisture-proof, anti-aging, insulation, high hardness, and high bonding strength
Glue recommendation: HN-8801 epoxy flame retardant electronic potting adhesive
Reason for recommendation: HN-8801 flame retardant epoxy resin potting adhesive, with a flame retardant grade of UL94-V0, has low viscosity, good fluidity and is easy to penetrate into the product gap; After curing, there is no bubble, the surface is flat, shiny, high hardness, waterproof and insulating.

3、 Adhesive for heat conduction
Glue application position: bonding between the heat generator and the heat conducting material
Requirements for glue: high temperature resistance, good heat dissipation and high thermal conductivity
Recommended glue: HN-302 thermal conductive silicone grease
Reason for recommendation: HN-302 is applicable to the transmission medium of electronic components. It can effectively reduce the working temperature of heating elements with high temperature resistance of 200 ℃ and no dryness, good heat dissipation and high thermal conductivity (4.0-6.0).