Can room temperature curing electronic potting adhesive shorten the curing time by heating?

Room temperature curing electronic potting adhesive is an adhesive used for packaging and protecting electronic devices, and can be cured at room temperature. It has good flowability and can penetrate even small gaps; After waiting for complete curing, the adhesive layer has high hardness and strong protective ability, but it takes 24 hours to fully cure. If the temperature is low in winter or the adhesive layer is thicker, the curing time will be longer. Can we shorten it by heating it up?

The main type of room temperature cured electronic potting adhesive is epoxy resin, which has flame retardancy and thermal conductivity. Its curing time can be shortened by heating. The temperature is recommended to be around 60 degrees Celsius, depending on the situation. However, before heating, it is necessary to consider whether the potting product can withstand 60 degrees Celsius baking. Do not operate blindly, and the heating temperature should not exceed 60 degrees Celsius, otherwise the potting adhesive may have bubbles or uneven surface, Affects the sealing effect in the later stage.

In general, it is not recommended to heat the room temperature curing electronic potting adhesive because its temperature resistance range is relatively low, below 80 degrees. Although heating can accelerate its curing speed, it may also affect its performance.