HANAST engineers tell you about the common problems and countermeasures of addition molding silicone sealant

Organic silicon sealing adhesive refers to a type of electronic sealing adhesive made of silicone rubber, which can be divided into two component condensed organic silicon sealing adhesive and two component additive formed organic silicon thermal conductive sealing adhesive according to different reaction mechanisms. Today, HANAST engineers will mainly introduce the common problems and countermeasures of addition molding silicone sealant.
1. How to solve the problem of "poisoning" and non curing of added silicone sealant?
The phenomenon of incomplete curing or incomplete curing that occurs when the addition molding silicone sealant comes into contact with ionic compounds containing N, P, S organic compounds, Sn, Pb, Hg, As, and other elements, as well as alkynes and polyvinyl compounds, is called "poisoning". The solder joints and residual rosin on the circuit board all contain the above compound components. When using the circuit board, it is recommended to clean the residual rosin as much as possible, use low lead solder as much as possible, and use heating curing method for curing.

Common materials and articles that are likely to cause "poisoning" of addition silicone potting adhesive: lead solder, flux, hot melt adhesive, condensed silica gel (including single and two-component condensed silica gel), vulcanized rubber, etc.
2. The addition molding of silicone sealant cures slowly in winter
The curing speed of adhesive is closely related to the ambient temperature. In winter, when the temperature is low, the curing speed of adhesive is slow, which can be solved by heating.
3. What can I use to clean the electronic potting adhesive that I accidentally stuck to?
The commonly used silica gel cleaning agents mainly include alcohol, acetone, Baijiu, etc.