Instructions for the use of thermal conductive potting adhesive

Thermal conductive potting adhesive has excellent electrical insulation and heat dissipation performance, and can also withstand environmental pollution, avoiding damage to electronic devices such as power supplies due to environmental factors such as stress, vibration, and humidity; Many customers have reported various issues with it during use, and after communication, they have found that the cause is actually due to improper operation.

To address this issue, HANAST engineers are here today to provide you with a detailed explanation of how to use thermal sealing adhesive:
1. Before use, make sure to mix A/B evenly (agent A has been left for a long time and there is a filler at the bottom),
2. Weigh with an electronic scale in a 1:1 weight ratio,
3. Mix and stir AB evenly (stirring should be done clockwise and at a constant speed in the same direction),
4. After mixing and stirring evenly, let the exhaust bubble stand for a few minutes to seal the product. The glue will gradually penetrate into the gaps of the product, and if necessary, a secondary glue filling can be carried out. Complete curing within 24 hours.

Do not bring air into the adhesive when stirring the thermal conductive potting adhesive, otherwise it will generate bubbles, affect the performance of the adhesive, and lose its protective effect on electronic devices. If you have a vacuum machine, it is recommended to remove the air when using the adhesive.