Introduction to the characteristics, application methods, and precautions of dual component silicone potting compound

1、 Introduction to two component silicone potting compound:
1. Two component organic silicone potting compound is a sealing material that is solidified by room temperature or heating when AB two components are mixed and used. The main functions of sealing are sealing, waterproofing, thermal conductivity, etc;
2. According to different curing methods, it can be divided into addition molding and condensation molding. The proportion of AB component in addition molding potting compounds is generally 1:1, with A component being black and B component being white. After mixing, it turns into gray and black.
3. The organic silicon gel is also an additive two-component organic silicone potting compound, which generally has no filler and is transparent after curing (it may also be blue or other colors as required).
4. The ratio of AB component in the shrink type potting adhesive is generally 10:1 or 5:1. Component A is transparent or black or white, while component B is transparent.

2、 The main characteristics of dual component silicone potting compound:
1. Two component addition molding silicone sealant is completely non-toxic and has excellent operability. It is very convenient to operate and has excellent foam removal performance. It can achieve good thermal conductivity according to needs, low stress after curing, and is very easy to repair and clean. It has good weather resistance, a very wide temperature range, -40-250 ℃, and the disadvantage is poor adhesion.
2. Condensed organic silicon sealant is cured by moisture at room temperature and has a certain bonding effect after curing. It is mainly used for sealing products with low thermal conductivity and high waterproof requirements.

3、 Market application of dual component silicone potting compound:
1. The addition molding potting adhesive is mainly used in situations that require waterproof sealing and thermal dissipation, such as driving power supplies, control modules, reactors, transformers, inverters, optimizers, heating coils, etc.
2. Organic silicon gel is mainly used in products with high purity, such as IGBT, thyristor, pressure sensor, automotive electronic module/sensor/harness, intelligent water meter, electric waterproof junction box, filter, rain light sensor, camera system, optical sensor, etc.

4、 Usage method for two-component silicone thermal conductive potting compound:
1. Before applying glue, mix components A and B evenly in their respective packaging, as the filling material may partially settle during storage.
2. Weigh components A and B in a 1:1 ratio, mix evenly, and directly inject them into the components (or modules) that need to be sealed for protection. It is best to slowly inject along one side of the vessel wall to reduce the generation of bubbles.
3. Leave the sealed components to stand and allow them to self bleed. After the bubbles have basically disappeared, they can be heated and cured, or they can be cured directly at room temperature, which takes approximately 5 hours.

5、 Precautions for dual component silicone potting compound:
1. If the addition molding sealing adhesive with fillers is left for too long, it may cause sedimentation. It is recommended to mix components A and B evenly before use, and pay attention to sealing and storage after use;
2. When mixing, attention should be paid to mixing in the same direction, otherwise too many bubbles will be mixed in. The adhesive material on the container frame and bottom should also be evenly mixed, otherwise local non curing phenomenon may occur due to uneven mixing.
3. Pouring onto the product and vacuuming again to remove bubbles can improve the overall performance of the cured product.
4. If the temperature of the addition molding potting adhesive is too low, it will lead to a slower curing speed. It is recommended to heat and cure.
5. Contact between addition molding silicone potting compound and materials containing tin, sulfur, amine, etc.