Operation method of electronic potting compound

Electronic potting compound can be divided into manual filling and machine filling. The 1:1 addition molding is machine-filled, and in the future, the market with high usage will be 1:1.

There are three methods of operation
Type: Single-component electronic potting compound, can be used directly, can be shot or poured directly
Second type: two-component condensed electronic potting compound, curing agent 2% -3%, stirring vacuum defoaming infusion
Third type: additive electronic potting compound, curing agent 1:1, 10:1