Quick curing method for potting glue

Before curing, potting glue is a flowable liquid adhesive that can effectively protect electronic equipment products after curing, thereby achieving waterproof, moisture-proof, dustproof, insulation, thermal conductivity, corrosion resistance, high and low temperature resistance, and other functions. There are two ways to cure silicone sealant: one is to cure at room temperature, and the other is to accelerate the curing speed by heating up. So what is the difference between these two curing methods, and which curing method is better to use.

There are certain requirements for the curing temperature of silicone sealant. In general, the higher the temperature, the faster the curing time. On the contrary, the lower the temperature, the slower the natural curing rate. In the cold winter, the temperature is relatively low, and the curing speed of electronic potting glue is extremely slow after mixing, and the presence of curing is not felt for a long time.
 

Correct operation method for rapid curing:
1. Stir each component evenly. After stirring the colloid, it can stand still for about 10 minutes before pouring the glue, allowing the colloid to self bubble for a period of time, which is conducive to solidification.
2. After stirring, wait for each component to heat up before mixing and gluing to accelerate curing.
3. The more glue is added at once, the faster the curing will be. The less glue is added, the slower the curing will be.
4. By appropriately increasing or decreasing the curing agent, the curing rate can be adjusted, and increasing the dosage of the curing agent can improve the curing.
5. After gluing, heating and curing can accelerate the curing speed.
6. Heating agent A at 60-80 degrees Celsius for 1-2 hours can remove moisture and accelerate solidification.
7. Extending the stirring time appropriately can accelerate the curing rate.
8. Try to choose non rainy days for sealing, as humid weather is not conducive to curing. Try to stay away from windows and apply glue during the day.

We have found through experimental research that the relationship between temperature and the curing time of organosilicon encapsulation is as follows:
At room temperature of 20-25 ℃, the curing time of the sealing adhesive at room temperature is generally 20-30 minutes, and the mixed curing time is 6-8 hours. When heating and curing at 50 ℃, the curing rate is 4-6 hours. When heating and curing at 100 ℃, the mixed curing rate is 1-2 hours. When heating and curing at 150 ℃, the mixed curing rate can be accelerated to 30-60 minutes. However, it should be noted that if an excessively high temperature is used for accelerated curing, it should be noted that rapid curing can weaken the automatic defoaming effect of the silicone sealant. After complete curing, there may be many bubble products in the sealant, resulting in a weakened thermal conductivity. So if there is no special requirement for curing time, we generally recommend using room temperature curing method.