What is thermal conductive silicone grease
Apr 09,2024 Hanast
Many people have experience assembling or cleaning a computer host. When installing a CPU fan, it is necessary to apply a layer of thermal conductive silicone grease on the surface of the CPU. Or, after using the host for a period of time, it is obvious that the temperature of the CPU or graphics card is too high and affects the operation of the computer. After cleaning, what is thermal conductive silicone grease?
Thermal conductive silicone grease is a semi fluid paste like composite based on silicone resin, which has high thermal conductivity, low thermal resistance, and excellent lubrication performance. It can form an extremely thin surface layer at rough interfaces and is easy to be reworked. It is commonly used to fill the gaps between power consuming electronic components and heat sinks, improving the thermal conductivity efficiency of heat sinks. It is widely applicable in the current industrial process field.
During the operation of the equipment, heat is inevitably generated. Prolonged operation at high temperatures can damage the lifespan and performance of the equipment. Therefore, a heat sink is installed on the surface of the heat source to lower the temperature of the equipment. However, there are gaps between the heat source and the heat sink, and heat transfer between the two is hindered by the air, which reduces the heat conduction rate and thus reduces the heat dissipation effect.
The function of thermal conductive silicone grease is to apply air in the gap between the radiator and the heating source, eliminate air in the gap, and fill the gap, reducing the contact thermal resistance between the two, thereby improving the rate of heat transfer between the two. The price of thermal conductive silicone grease is practical and easy to operate, and it has a good filling effect in many irregular planes. Compared with gaskets, the thermal conductive effect of thermal conductive silicone grease is better than that of thermal conductive gasket materials.