Which potting adhesive has better thermal conductivity

We have mentioned before that there are three main types of potting adhesives: epoxy resin potting adhesives, silicone potting adhesives, and polyurethane potting adhesives. Each product has different characteristics about thermal conductivity.

The thermal conductivity of epoxy resin potting adhesive is the lowest among the three. The thermal conductivity of the epoxy resin potting adhesive can reach 1.2 at most, and the others are more than that.

However, it is characterized by high hardness and good pressure resistance. In many cases where thermal conductivity requirements are not very high, epoxy resin potting adhesive is the most suitable.

The silicone potting adhesive can achieve the best thermal conductivity. The silicone potting adhesive has a maximum thermal conductivity of 3.0. It is soft, single-component and easy to use. The silicone potting adhesive has the highest temperature resistance, can be reworked, and can absorb vibration and reduce noise. Therefore, its confidentiality is poor and it can not withstand pressure.

The thermal conductivity of polyurethane potting adhesive is higher than that of epoxy resin potting adhesive, and its thermal conductivity can reach 2.0. It is characterized by good low temperature resistance, and can withstand low temperature - 40 ℃. Compared with other adhesives, it has the advantages of low temperature resistance and is also a soft adhesive. Like silica gel, it can not be used as a surface, nor can it withstand pressure.

High thermal conductivity potting adhesive is mainly used for electrical potting with high heat output and strict sealing. Simply requiring high thermal conductivity may affect other performance indicators of potting adhesive. Therefore, it is still necessary to consider comprehensively in combination with its own potting process, equipment structure design, temperature resistance during later use, and sealing requirements of electronic components. With regard to the selection of high thermal conductivity potting adhesive, the hard or soft high thermal conductivity potting adhesive should be selected according to the device and purpose to be potted. We produce high thermal conductivity and high temperature resistant epoxy resin potting adhesive (hard), with thermal conductivity of 0.8-2.0. In terms of high temperature resistance, there are many application cases in potting process, high temperature resistant potting adhesive and high thermal conductivity potting adhesive, which can be discussed at any time.