What is thermal conductive encapsulated silicone rubber?

Heat conductive potting adhesive (HCY) is a low viscosity, flame retardant, two component addition molding silicone heat conductive potting adhesive that can cure at room temperature or heat, with the characteristic of faster curing at higher temperatures. It is a product made by ordinary sealing silicone or adhesive silicone with thermal conductivity added. It is generally produced by excellent manufacturers and does not produce any by-products during the curing reaction. It can be applied to materials such as PC (Poly carbon), PP, ABS, PVC, and metal surfaces. Suitable for thermal conductivity, insulation, waterproofing, and flame retardancy of electronic accessories, with a flame retardancy level of UL94-V0. To comply with the requirements of the EU ROHS Directive. The main application field is the encapsulation of electronic and electrical components and components, as well as for applications such as temperature sensor encapsulation. The most common thermal conductive sealing silicone is composed of two components (A and B), including addition or condensation type silicone rubber. The addition type can be deeply sealed without the production of low molecular substances during the curing process, with extremely low shrinkage rate and good adhesion to the component or sealing cavity wall. The shrinkage rate of the condensation type is higher, and the adhesion to the cavity components is lower. Single component thermal conductive encapsulated silicone rubber also includes two types: condensation type and addition type. The condensation type generally has good adhesion to the substrate but is only suitable for shallow encapsulation. Single component thermal conductive silicone rubber generally requires low temperature (stored in the refrigerator), and needs to be heated and cured after encapsulation. Thermal conductive encapsulated silicone rubber can obtain different thermal conductivity coefficients based on the addition of different thermal conductive substances. Ordinary ones can reach 0.3-0.8, while high thermal conductivity ones can reach above 4.0. Generally, manufacturers can allocate according to their needs.