Common problems in the use of electronic potting glue for electronic products

Silicone "poisoning" generally occurs in addition-type electronic potting glue. After poisoning, the silica gel will not solidify. If we find that the addition-type potting glue is poisoned, we should avoid other unused potting glues from coming into contact with phosphorus, sulfur, It is in contact with organic compounds of nitrogen and can be mixed with other addition type, condensation type room temperature vulcanized silicone rubber and other products. To prevent "poisoning" and non-curing phenomenon.

How can I clean the potting glue that I accidentally stuck on during my daily work? Generally, use water diluted with alcohol or acetone to wipe, and then soak and clean.

What should I do if the electronic potting glue cannot dry at low temperatures? Under relatively low temperature conditions, the electronic potting glue cures very slowly or even does not cure for a long time after mixing. We have to increase the temperature to meet the curing requirements.

What advantages does electronic potting glue have over other potting glues?

It can provide long-term and effective protection for electronic components, electronic modules and devices. After the potting glue is cured, it forms a soft elastomer, which can eliminate the impact force caused by impact and vibration within a wide range of temperature and humidity. It can maintain its original physical and electrical properties in various working environments, resist degradation by ozone and ultraviolet rays, and has good chemical stability.

After potting, it is easy to clean and dismantle, so that the electronic components can be repaired, and new potting glue can be re-injected into the repaired parts.

What is the difference between addition type potting glue and condensation type potting glue?

The biggest difference between addition-type potting glue and condensation-type potting glue is that the condensation type has small molecular substances, while the addition type does not. This is also the difference in performance between the two. The addition type room temperature potting glue is bonded by the addition reaction of silicon hydrogen bond and ethylene double bond under the action of platinum catalyst. No small molecules are produced during the reaction process; the condensation room temperature potting glue is made of silica gel and ethylene double bond. In the presence of a catalyst, the active groups of the curing agent condense and release small molecules for adhesive curing.