Heat dissipation of power adapters

The laptop power adapter may encounter heat dissipation issues during use. When the power adapter is operational, it converts the output electricity, which consumes energy and transforms a portion into heat. The laptop power adapter is a high-precision, high-efficiency switch-mode-regulated power supply. Its function is to convert 220V AC mains power into low-voltage DC power, ensuring stable power for the normal operation of laptops, and it is known as the "power source" of laptops.

This section provides an overview of the heat dissipation capabilities of the power adapter's thermal encapsulant. The thermal encapsulant, a new type of thermally conductive material synthesized from silicone, is a two-component additive molding material that does not emit heat during curing, is non-corrosive and exhibits minimal shrinkage. It possesses exceptional electrical properties and outstanding resistance to extreme temperatures (-50°C to 250°C). It is suitable for various thermal sealing and casting applications on electronic components, power adapters, transformers, thyristor modules, sensors, etc., forming a thermally conductive and flame-retardant system. It offers superior waterproofing, moisture resistance, and shock protection. It does not corrode plastic parts, ensuring the safe operation of electronic components even under harsh conditions.

The key features of this material include: It cures at room temperature, offers rapid curing speed, high production efficiency, and is easy to use. It maintains rubber elasticity across a wide temperature range (-50°C to 250°C), exhibits excellent electrical performance, and possesses good thermal conductivity. It is waterproof, moisture-proof, resistant to chemical agents, resistant to yellowing, and resistant to weathering for over 25 years. It exhibits good adhesion with most materials, including plastics, rubbers, reinforced nylon PA, and polyphenylene oxide PPO. It fully complies with the EU's ROHS environmental directive.