How to choose sealing adhesive for electronic components? What performance are required?

With the rapid development of the electronic industry, the application of electronic potting adhesive in electronic products is becoming increasingly widespread. Encapsulated electronic products can enhance their waterproof, seismic, and heat dissipation capabilities, electric appliance adhesive protecting them from the erosion of the natural environment and extending their service life.

Electronic potting adhesive is a liquid adhesive poured onto electronic components, which can provide excellent heat dissipation and flame retardant performance for electronic components. It can also effectively improve the seismic and moisture resistance of electronic components, ensuring their stability in use. So what performance requirements does an electronic potting adhesive suitable for electronic components need to meet.silicone potting compound for electronics

1. Strong electrical insulation ability, which can effectively improve the insulation between internal components and circuits after sealing;
2. It has hydrophobic properties and can improve the moisture-proof performance of electronic components after encapsulation;
3. Having excellent thermal conductivity, it can effectively improve the heat dissipation ability of electronic products after encapsulation;
4. Having excellent weather resistance and salt spray resistance, ensuring that electronic components are not corroded by the natural environment;
5. Colloids have no corrosive effect on electronic components;
6. The solidified colloid will not undergo deformation even after mechanical processing;
7. Strong resistance to cold and hot changes, even when subjected to cold and hot changes between -60 ℃ and 200 ℃, the colloid can still maintain elasticity and not crack;
8. Can be cured at room temperature or at elevated temperature;