Issues to pay attention to when using electronic potting compound

Electronic potting compound is a new type of adhesive widely used in the fields of oven electronic components,potting compound for electronic components cement electric furnaces, kerosene furnace electronic components, etc., also known as electronic adhesive by industry insiders. With the popularity of potting adhesive, a large number of enterprises have flocked to it.

So, let's talk about some issues that need to be paid attention to when using potting adhesive:
1. Failure to stir before use, or failure to layer pigments and fillers during storage, resulting in curing failure;
2. Changes in environmental temperature lead to changes in the curing rate and flowability of the adhesive;
3. Inaccurate weighing, uneven mixing, and incomplete solidification of the solidified material due to temperature or time;
4. Poor sealing after opening causes moisture absorption and crystallization;
5. Excessive amount of adhesive or prolonged use can lead to "burst aggregation";
6. Evaluation of product changes caused by moisture during solidification;
7. The treatment of bubbles on the surface of the solidified material affects the apparent curing failure;
8. Light colored cured materials may undergo color changes due to conditions such as curing temperature and ultraviolet radiation;
9. Electrical and chemical engineers failed to design accelerated and destructive aging life experiments according to the characteristics of A/B adhesive and the needs of electrical products;
10. Evaluation of various changes in the impact of curing temperature changes on the curing performance of materials;
11. The assessment of material damage to the vacuum system, or the impact of the stability of the vacuum system on quality;