Test guide for thermal conductivity of potting adhesive

In order to protect the environment and save energy, current electronic products need to use a large number of materials with thermal conductivity, such as heat-conductive potting adhesives.

These potting adhesives have a series of thermophysical properties. In order to reasonably use and select functional materials, it is necessary to calculate their thermophysical properties. Therefore, it is very important to understand and measure the thermophysical properties of potting adhesives, The thermophysical parameters of materials used in electronic products include thermal conductivity, thermal conductivity, specific heat, etc. The following is the operation process of using thermal conductivity tester in our company's laboratory to test the thermal conductivity of potting adhesive.

1, Test preparation

1. Use the thermal conductivity tester to test the thermal conductivity. When making the standard sheet, you must select the appropriate sample preparation mold according to the size of the sample ring.
2. The mixed two-component potting adhesive is de-bubbled with vacuum equipment. It is slowly poured into the standard mold to prevent air from entering. Other types of products also need to be de-bubbled.
3. In order to save time, heating curing can be selected if curing conditions permit.

2, testing procedure

1. Take out the cured standard sheet of thermal conductive potting adhesive and cool it to room temperature;
2. Set and adjust the constant temperature water bath temperature to be consistent with the room temperature, or set the thermal conductivity under other constant temperature conditions, and set it according to the parameter requirements;
3. Wipe the lower heat measuring electrode (the steel ring in the lower clamp) with a clean dust-free cloth to prevent moisture, put the sample ring on the steel ring of the lower clamp, and put the standard sheet of potting glue;
4. Start the automatic test system to test the thermal conductivity of the potting adhesive.

3, influence factor

After years of testing experience and data summary and analysis of the thermal conductivity of potting adhesive, even if the same products such as raw materials, production process, storage method and production date are affected by humidity, temperature, pressure, sample structure, curing conditions and other factors, the thermal conductivity obtained is also different. Therefore, these factors must be excluded during the testing process to obtain accurate thermal conductivity values.