Understanding the Characteristics of High Temperature Resistant Electronic potting compound

The high-temperature-resistant electronic filling agent can also be used as a high-temperature-resistant electronic potting compound, which can withstand temperatures of 120 ℃ or even higher. The high-temperature-resistant electronic potting compound is liquid and has fluidity before curing. The use value of a high-temperature-resistant electronic potting compound can only be realized after it is completely cured. After curing, it can play a role in dust prevention, insulation, heat insulation, confidentiality, corrosion resistance, high-temperature resistance, and shock resistance. The components of high-temperature-resistant electronic sealing adhesive are all inorganic components. The main difference between other sealing adhesives is that they are resistant to high temperatures. Ordinary epoxy resin can soften or scorch at temperatures above 100 degrees Celsius. High temperature-resistant electronic sealing adhesives, even at temperatures of 120 degrees Celsius, still do not soften. Instead, with the increase in usage time and temperature, their performance improves, and their hardness and adhesion further increase. Easy to bake, completely water-based, environmentally friendly, no toxic organic gas volatilization, evolving the air environment of electronic workshops.
Usage: Directly seal, and when using, silicon oxide (white carbon black) can be added as a curing agent together. Silicon oxide (white carbon black) can act as a curing agent and filler.
Good oil resistance performance; Acid and alkali resistance.

Thickness: According to the customer's own needs, the thickness can be freely adjusted. It can be thoroughly dried at a low temperature of around 70 ℃ or room temperature. Only after thorough drying can it be used at high temperatures.
The main application range of high-temperature resistant electronic sealing adhesive is:
High-temperature sensors, gas chromatography electronic components, high-temperature furnace electronic components, muffle furnace electronic components, kiln electronic components, oven electronic components, kerosene furnace electronic components, electric furnaces, steel plants, cement plants, calciners, high-temperature mechanical electronic components, high-temperature electronic switches, resistors, high-temperature resistant hanging scales, and so on.